JAPAN // TOKYO
48 GPUs
Robotics AI Cluster Build
Deployed custom liquid-cooled PARICH GI4205L servers integrated with 100G RoCE networking for real-time model inference and physics simulation.
// PARICH NEXT-GEN COMPUTE
Operational AI Infrastructure for High-Density Workloads
Direct liquid-cooled GPU servers, modular container pods, and turnkey site integration. Built for extreme thermal efficiency and rapid cluster scaling.
PARICH OPERATIONAL MATRIX
REAL-TIME
PUE EFFICIENCY
≤ 1.16
Liquid Hybrid @ 25°C
THERMAL DENSITY
35 kW
Per Cabinet (Liquid)
DEPLOYED CAPACITY
40+ MW
Global Operations
SLA AVAILABILITY
99.9%
NOC & Facility Uptime
CORE CAPABILITIES
Direct-to-Chip Liquid Cooling
RTX 5090 & B300 Ready
Containerized Pods
InfiniBand / RoCE Fabric
Global Turnkey Logistics
24/7/365 On-Site NOC
01 // SOLUTION ARCHITECTURE
Integrated Infrastructure Stack
PARICH eliminates multi-vendor friction by unifying server hardware, thermal loops, containerized facilities, and operations into a single deployable stack.
01
High-Density Hardware
Direct liquid & air-cooled 4U GPU servers designed for TDPs up to 350W+ per CPU.
02
Modular Container Facilities
Dual-stack containerized data centers housing up to 9x 45U racks with quick-disconnect CDU manifolds.
03
GPU Compute Leasing
Bare-metal instances, dedicated multi-GPU nodes, and isolated full-rack high-bandwidth clusters.
04
Turnkey Field Operations
Engineering design, international customs & freight, power hookup, and 24/7 hardware telemetry.
PARICH ARCHITECTURE HIGHLIGHT
End-to-End Thermal & Power Optimization
Traditional data centers waste up to 40% of incoming power on cooling fans and air movement. PARICH direct-to-chip liquid cooling targets heat at the source, reducing PUE down to 1.16 and enabling 35kW+ per rack power density.
- Cooling Medium: Copper Cold Plates + EPDM Industrial Liquid Piping
- Manifold System: UQD8 Quick-Disconnect Valve Architecture
- Network Interconnect: Dual-Port 100G/200G/400G RoCE v2 & InfiniBand
- Power Architecture: 3-Phase 400V PDU with Platinum 3+1 Redundancy
02 // HARDWARE PORTFOLIO
Flagship Server Systems
Engineered specifically for sustained large language model (LLM) training, multi-modal inference, and HPC workloads.
AIR-COOLED ALTERNATIVE
PARICH GI4205 Air-Cooled
Designed for standard air-cooled data center facilities needing extreme GPU density without liquid piping infrastructure.
- 4U Chassis supporting up to 8x blower GPUs
- 8x High-Static Pressure Counter-Rotating Fans (N+1)
- Optimized airflow ducts preventing internal heat recirculation
THERMAL ENGINEERING
Precision Liquid Cold Plates
Custom-milled high-purity copper cold plates engineered for direct contact with GPU core dies and VRAM chips.
- Anti-corrosion nickel-plated copper thermal surface
- Zero-leak UQD quick-disconnect dry-break couplings
- Real-time coolant flow, pressure & temperature sensors
03 // CONTAINERIZED INFRASTRUCTURE
PARICH Modular Container DCs
Deploy multi-megawatt compute clusters anywhere in weeks instead of years. Pre-tested, self-contained data center environments.
570 kW
Cooling Capacity
9 Racks
45U High-Density Space
35 kW/Rack
Liquid Heat Dissipation
1.16 PUE
Energy Efficiency Rating
Features integrated CDU (Coolant Distribution Unit), 3-Phase 400V power distribution, automated fire suppression, emergency backup ventilation, and remote telemetry monitoring.
04 // COMPUTE & COLOCATION
Flexible Compute & Infrastructure Housing
Whether you need on-demand GPU instances or dedicated container space for your own hardware, PARICH offers scalable access models.
Bare-Metal GPU Leasing
Dedicated bare-metal instances featuring NVIDIA RTX 5090, PRO 6000, and B300 accelerators with root access and unthrottled NVLink/RoCE performance.
Dedicated Pod Leasing
Lease full rack pods or entire PARICH container units. Bring your own server hardware into our pre-cooled, powered, and monitored facility infrastructure.
Clustered Multi-Node Fabrics
Custom-wired cluster topologies with ultra-low latency InfiniBand switches, dedicated high-speed NVMe flash arrays, and isolated network VLANs.
Remote Hands & NOC
24/7/365 physical and digital support. On-site PARICH engineers handle rack-and-stack, cable routing, coolant topping, and rapid hardware replacement.
05 // DELIVERY METHODOLOGY
PARICH Turnkey Deployment Pipeline
A seamless, engineering-led lifecycle from initial workload analysis to operational handoff.
01
Workload Audit
Thermal assessment, target GPU count, power budget, and site constraints definition.
02
Engineering Design
CDU piping schematics, PDU power balances, network fabric mapping & rack layouts.
03
Integration & QC
Factory assembly, custom BIOS/firmware flashing, stress burn-in & leak testing.
04
Logistics & Transit
International customs clearance, secure transport, and site delivery.
05
Commissioning
Power hookup, liquid loop purging, network isolation & cluster burn-in.
06
Active Operations
24/7 telemetry monitoring, preventative maintenance & hardware replacement SLA.
06 // GLOBAL TRACK RECORD
Proven Deployment Cases
Real-world AI infrastructure projects delivered across primary Asia-Pacific and global regions.
SINGAPORE
128 GPUs
Financial LLM Training Pod
Engineered isolated high-density rack pods with direct CDU liquid loops and custom power redundancy to satisfy strict latency and uptime requirements.
MALAYSIA
512 GPUs
Cloud Provider Expansion
Managed turnkey international shipping, local customs, site installation, and network commissioning for a large-scale public compute cloud.
GLOBAL SITE
570 kW Container
Modular Container DC Handover
Delivered a factory-assembled dual-container DC pod to a high-ambient temperature region, maintaining sub-1.18 PUE under heavy continuous load.
// START YOUR BUILD
Ready to Architect Your AI Infrastructure?
Consult with PARICH systems engineers. We will analyze your GPU workload, thermal limits, and budget to provide a turnkey deployment proposal within 24 hours.